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GOLDMAN SACHS

New York, United States

infrastructureFounded 20260

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Recent News

Helsing raises $1.8bn Series E to scale European defense AI

On July 13, 2026, German defense AI company Helsing announced a $1.8 billion Series E round valuing the firm at $18 billion. The capital, backed by Dragoneer, Lightspeed, Goldman Sachs Alternatives, JPMorgan Chase and others, will fund new AI platforms and integrations with partner nations’ defense systems.

Jul 13Helsing

Taktile raises $110M Series C to scale AI decision agents

On June 24, 2026 decisioning platform Taktile announced a $110 million Series C round led by Growth Equity at Goldman Sachs Alternatives, with participation from Balderton, Index Ventures, Tiger Global, Y Combinator and Dig Ventures. The company will use the capital to expand its agentic AI platform for automating high‑stakes banking and insurance decisions across the US, EMEA and Latin America.

Jun 24Business Wire
Nvidia raises $25 billion in bonds to fuel AI chip expansion

Nvidia raises $25 billion in bonds to fuel AI chip expansion

On the evening of June 15, 2026, Nvidia increased its planned bond sale and will now raise $25 billion in its first investment‑grade corporate bond issuance since 2021. Investor orders reached about $85 billion across seven tranches, with proceeds earmarked for general corporate purposes as the company scales AI chip production.([boursorama.com](https://www.boursorama.com/bourse/actualites/selon-certaines-sources-nvidia-s-apprete-a-lever-25-milliards-de-dollars-dans-le-cadre-de-sa-premiere-emission-d-obligations-d-entreprise-depuis-cinq-ans-0460f33e100fb94530d66a190d9ee99a))

Jun 15Boursorama (Reuters, French edition)

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