Biren Technology seeks $515m share sale to fuel China AI chips

Shanghai Biren Technology announced plans in a Hong Kong filing late October 7, 2026 to place 130 million new H shares at HK$31.08 each, raising about HK$4 billion (roughly $510–515 million). On October 8, South China Morning Post and other outlets reported the stock fell about 12 percent as investors reacted to the discounted placement, Biren’s third major capital raise since its January IPO, with proceeds earmarked for next generation GPU production, supply chain procurement and R&D.