Shennan Circuits plans ¥48.82B raise for AI server PCB capacity

On the evening of June 12, 2026, Chinese PCB manufacturer Shennan Circuits announced plans for a targeted share issue to raise up to 4.882 billion yuan. The funds will primarily finance an AI compute electronic circuit project in Wuxi to expand production of high‑speed, high‑density multilayer PCBs for AI servers and switches.