TSMC announced that its 2‑nanometre (N2) process has entered volume production in Q4 2025 at its Fab 22 facility in Kaohsiung, Taiwan. The company calls N2 the industry’s most advanced technology in density and energy efficiency, and notes it will power leading customers including Nvidia and Apple.
This article aggregates reporting from 2 news sources. The TL;DR is AI-generated from original reporting. Race to AGI's analysis provides editorial context on implications for AGI development.
TSMC’s move to volume production at 2nm is the quiet but foundational news that will underwrite the next wave of model scaling. Nearly all leading AI players—Nvidia, Apple, and by extension cloud providers—depend on TSMC’s road‑map to squeeze more performance per watt out of each die. N2’s nanosheet transistors promise both higher density and better energy efficiency, which matters as hyperscalers slam into power and cooling constraints even faster than they hit pure capex limits.([straitstimes.com](https://www.straitstimes.com/business/taiwans-tsmc-says-it-has-started-mass-production-of-most-advanced-2nm-semiconductor-chips//))
In practice, this means that chips taping out now for 2026–2027 AI systems—training accelerators, edge inference SoCs, and AI‑centric smartphone and PC processors—will increasingly ride on 2nm. That tilts the playing field in favour of those with the deepest TSMC allocation and the capital to absorb N2’s higher wafer costs. For the race to AGI, more efficient silicon doesn’t just enable bigger models; it also makes it politically and environmentally more defensible to run them. Still, it concentrates even more systemic importance in a single geography: southern Taiwan, which remains a geopolitical flashpoint.

